发明名称 HIGH SPEED ELECTRICAL CONTACT ASSEMBLY
摘要 <P>PROBLEM TO BE SOLVED: To provide a contact assembly that can accommodate high data speeds while maintaining a size for retrofit applications in existing connection systems. <P>SOLUTION: The contact assembly includes an outer body and an insert assembly receivable in the outer body. The insert assembly includes a housing and a conductive barrier received in the housing. The conductive barrier defines first and second receiving areas in the housing. At least a first contact member is receivable in the first receivable area and at least a second contact member is receivable in the second housing area. Each of the first and second contact members is adapted to accept a conductor. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011253807(A) 申请公布日期 2011.12.15
申请号 JP20110106144 申请日期 2011.05.11
申请人 AMPHENOL CORP 发明人 DAVID ANTHONY PHILLIPS;HEATH ALLEN JOHNSON
分类号 H01R13/6471 主分类号 H01R13/6471
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