| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an imaging module of a wafer level having a high imaging quality. <P>SOLUTION: The method of manufacturing an imaging module 10 of a wafer level includes a step a for forming a first wafer having a photosensitive device 20 through a formation step of an integrated circuit, a step b for forming a second wafer having a lens unit 30, a step c in which the second wafer is overlapped with the first wafer while an adjusting material is excluded from between the first wafer and the second wafer, to obtain a focus deviation amount of the lens unit 30 of the second wafer, for determining whether or not the photosensitive device 20 of the first wafer is in focused state, and a step d in which the adjusting material 25 is positioned between the lens unit 30 and the photosensitive device 20, to correct the focus deviation amount using the adjusting material 25, with the adjusting material 25 being provided to contain a glass spacer ball or fiber spacer for the lens unit 30 for accurately imaging with the photosensitive device 20. <P>COPYRIGHT: (C)2012,JPO&INPIT |
