| 摘要 |
A method for manufacturing a printed circuit board with cavity includes following steps. First, a first substrate is provided. The first substrate includes a first electrically conductive layer defining an exposed portion and a laminating portion. Second, a second substrate is provided. The second substrate includes an unwanted portion corresponding to the exposed portion and a preserving portion. Third, a first annular bump surrounding the exposed portion is formed. Fourth, a second annular bump surrounding the unwanted portion is formed. Fifth, a first adhesive layer defining an opening is provided. Sixth, the first and second substrates are laminated to the first adhesive layer, the exposed portion and the unwanted portion are exposed in the opening, and the second annular bump is in contact with the first annular bump. Seventh, the unwanted portion is removed and a cavity is defined, the exposed portion is exposed in the cavity. |
