发明名称 Thermally reversible hot melt adhesive composition containing multifunctional diene and dienophile compounds
摘要 <p>The invention relates to a thermally reversible hot melt adhesive that is isocyanate-free, moisture independent, crosslinkable and thermally reversible. The thermally reversible hot melt adhesive may be repeatedly heated and cooled without negatively affecting the performance of the adhesive. The thermally reversible composition may also be used as a primer layer. The thermally reversible hot melt adhesive and primer are particularly well suited for end use applications such as packaging, graphic arts, construction, footwear, textiles, general assembly, automotive and consumer goods.</p>
申请公布号 AU2010260018(A1) 申请公布日期 2011.12.15
申请号 AU20100260018 申请日期 2010.06.11
申请人 HENKEL CORPORATION 发明人 HERR, DONALD;SRIDHAR, LAXMISHA M.;SLARK, ANDREW
分类号 C09J4/00;C09J133/00;C09J175/00;C09J201/00 主分类号 C09J4/00
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