| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-temperature Pb-free solder alloy capable of substantially withstanding the reflow temperature of about 300°C and excellent in wettability, joinability and reliability. <P>SOLUTION: The Pb-free solder alloy consisting mainly of Zn contains, by mass, 0.01-16.0% Ge as a second element, and at least one of ≥0.01 to <1.0% Al and 0.01-10.0% Sn as a third element, and P contains ≤0.500%. <P>COPYRIGHT: (C)2012,JPO&INPIT |
