| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a grinder device with a simple device configuration thereby decreasing a manufacturing cost, which allows a semiconductor wafer to be transported to holding means in a state where the semiconductor wafer is positioned at a desired position with a desired orientation. <P>SOLUTION: The grinder device includes a wafer feed part 16 for transporting a semiconductor wafer W from a temporary placing table 35 to a chuck table 3, an image capturing part 36 for capturing whole of the semiconductor wafer W on the temporary placing table 35, and a calculation part for calculating the center of the semiconductor wafer W and a formation position of an orientation flat 66 based on the captured image data of the semiconductor wafer W. The wafer feed part 16 positions the center of the semiconductor wafer W on the center of the chuck table 3 based on the center of the semiconductor wafer W. The chuck table 3 aligns the orientation of the semiconductor wafer W with an orientation of the chuck table 3 based on the formation position of the orientation flat 66. <P>COPYRIGHT: (C)2012,JPO&INPIT |
