SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

摘要

According to one embodiment, a semiconductor device including a conductive layer formed in a trench formed in a semiconductor substrate via an insulating film, an opening portion of the trench being formed with a plurality of interconnected concaves and with a curved surface as a folding fan so as to set to be the opening portion gradually wider from a sidewall of the trench towards a surface of the semiconductor substrate.