| 摘要 |
<P>PROBLEM TO BE SOLVED: To ensure conduction reliably while reducing a mounting area in wire bonding packaging. <P>SOLUTION: An aperture 17 is formed through a wiring board 10 at a predetermined position thereof, and a chip body 22 of a semiconductor chip 20 is mounted toward the wiring board 10 side so that a chip electrode 21 faces the aperture 17. An insulating substrate 12 at a position continuous to the aperture 17 of the wiring board 10 is removed to become an electrode expose part 18, and a substrate electrode 11a where a wiring layer 11 is exposed is formed. The chip electrode 21 and the substrate electrode 11a are connected in the aperture 17 and the electrode expose part 18 by being bonding with a wire 19. <P>COPYRIGHT: (C)2012,JPO&INPIT |
