发明名称 |
POLISHING APPARATUS AND POLISHING METHOD |
摘要 |
A polishing apparatus has a polishing section (302) configured to polish a substrate and a measurement section (307) configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface (310) configured to input a desired thickness of a film formed on a substrate to be polished and a storage device (308a) configured to store polishing rate data on at least one past substrate therein. The polishing apparatus includes an arithmetic unit (308b) operable to calculate a polishing rate and an optimal polishing time based on the polishing rate data and the desired thickness by using a weighted average method which weights the polishing rate data on a lately polished substrate. |
申请公布号 |
US2011306274(A1) |
申请公布日期 |
2011.12.15 |
申请号 |
US201113216576 |
申请日期 |
2011.08.24 |
申请人 |
SASAKI TATSUYA;YAMADA NAOSHI;KATSUMATA YOSHIFUMI;SHIMIZU NOBURU;TSUNO SEIRYO;MITSUYA TAKASHI |
发明人 |
SASAKI TATSUYA;YAMADA NAOSHI;KATSUMATA YOSHIFUMI;SHIMIZU NOBURU;TSUNO SEIRYO;MITSUYA TAKASHI |
分类号 |
B24B37/04;B24B49/03;H01L21/321 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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