| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element to make it clear whether the measure against static electricity with discharge patterns is effective or not for an LED element for flip-chip mounting having a characteristic electrode shape and a cross-sectional structure, since the measure against static electricity with the discharge patterns has been mainly presented to a semiconductor device equipped with an IC chip. <P>SOLUTION: A semiconductor light-emitting element 13 comprises an n-side bump 23 and a p-side bump 24 and carries out flip chip mounting on a circuit board 12 of an LED device 10. The n-side bump 23 and p-side bump 24 are formed using the plating method. Projections 23a and 23b which are connected to the n-side bump 23 and projections 24a and 24b which are connected to the p-side bump 24 face each other closely to form the discharge patterns. <P>COPYRIGHT: (C)2012,JPO&INPIT |
