发明名称 METHOD FOR PRODUCING EPITAXIAL WAFER
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for producing an epitaxial wafer having good forward voltage by reducing, than before, the failure of the forward voltage (Vf) generated by Si mixed when a p-type layer is formed. <P>SOLUTION: The method for producing the epitaxial wafer at least includes a step of epitaxially growing a p-type layer by hydride vapor phase epitaxy (HVPE) on a substrate of a compound semiconductor, wherein nitrogen gas is passed in an HVPE furnace when the temperature of the substrate is raised before starting the epitaxial growth of the p-type layer. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011251877(A) 申请公布日期 2011.12.15
申请号 JP20100127003 申请日期 2010.06.02
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 SHINOHARA MASAYUKI;NISHIYAMA KAZUYOSHI
分类号 C30B29/44;C23C16/30;C30B25/02;H01L21/205;H01L33/30 主分类号 C30B29/44
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