| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent slippage of molten solder droplets due to flux and supply the molten solder droplets to a desired position. <P>SOLUTION: The method of solder joint is provided so as to include a process in which a soldered object, to which solder paste including powder solder and flux is applied, is heated and a second process in which a molten solder discharge device discharges and applies molten solder droplets to the solder paste heated through the soldered object. <P>COPYRIGHT: (C)2012,JPO&INPIT |
