| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a Zn-based high-temperature lead-free solder paste which is suitable for die bonding of a power semiconductor element, assembling of various electronic components or the like, prevents crack or peeling of joined chip and can secure high joint reliability. <P>SOLUTION: The Zn-based high-temperature lead-free solder paste comprises Zn-alloy solder powders containing Zn of ≥70 mass%, metal powders consisting mainly of Ni or Cu and the balance flux. The metal powder is an Ni or Cu powder having an average particle size of 1-100 μm, or preferably the coated Ni or Cu powder, on the surface of which a coat comprising Au or Ag having a thickness of ≤1 μm is provided. The total metal powder accounts for 5-65 mass% with respect to 100 mass% of the total of the metal powder and Zn-alloy solder powder. <P>COPYRIGHT: (C)2012,JPO&INPIT |
