| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic circuit board containing a signal terminal which prevents occurrence of crack or breakage on a ceramic substrate when ultrasonic junction is executed between a signal terminal having a thickness of 1 mm or larger and a metal circuit board of a ceramic circuit board equipped with the metal circuit board and a metal heatsink on its surface. <P>SOLUTION: In the method of manufacturing a ceramic circuit board containing a signal terminal, a part of a signal terminal 13 having a thickness of 1.0 mm or larger is stacked on the surface of a metal circuit board 12 of a ceramic circuit board 20 in which the metal circuit board 12 is provided on one surface of a ceramic substrate 11 and a metal heatsink whose thickness is thicker than the metal circuit board 12 is provided on the other surface, and an ultrasonic horn is pressurized against the signal terminal 13 so that the metal circuit board 12 is jointed to the signal terminal 13. Here, a distance between the outer edge of a horn pressurizing point 15 of the signal terminal 13 and the outer edge of the metal circuit board 12 is 0.5 mm or longer. A distance between the outer edge of the horn pressurizing point 15 of the signal terminal 13 and the outer edge of junction surface of the signal terminal 13 is 0.5 mm or longer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
