发明名称 METHOD OF MANUFACTURING FLEXURE SUBSTRATE FOR SUSPENSION
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a flexure substrate for a suspension which can effectively prevent damage and breaking of a wiring of a flying lead part with suppressing an increase of the number of processes in a method of manufacturing a flexure substrate for a suspension using a subtractive process. <P>SOLUTION: In a process to form a first metal plating film made of such metal as Ni (nickel) as a conductor for connection between a metal substrate and a wiring, the first metal plating film is formed on at least a part of one or both sides of a wiring exposed at a flying lead part, as a reinforcing film to increase physical strength. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011253959(A) 申请公布日期 2011.12.15
申请号 JP20100127230 申请日期 2010.06.02
申请人 DAINIPPON PRINTING CO LTD 发明人 ADACHI TAKASHI;SATO MITSURU;ONUKI MASAO
分类号 H05K1/09;H05K3/24 主分类号 H05K1/09
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