| 摘要 |
A varnish composition includes (1) a benzoxazine resin having highly symmetric molecular structure; (2) at least one of naphthol type novolac resins, aniline type novolac resins and phenolic type novolac resins; (3) fillers. The benzoxazine resin having highly symmetric molecular structure, and the at least one of naphthol type novolac resins, aniline type novolac resins and phenolic type novolac resins contribute to increase the temperature of glass transition of the varnish composition, while decrease the coefficient of thermal expansion and moisture absorbability due to their small and highly symmetric molecular structures. A copper substrate can meet the requirement of high temperature of glass transition (TMA≧200° C.) and low coefficient of thermal expansion (α1/α≦̸30/1350(μm/(m° C.). Therefore, the composition of the invention can be widely used as high-performance electronic material. |
