COPPER ALLOY STRIP MATERIAL EXCELLENT IN HEAT DISSIPATION AND ADHESION AND PREPARED FOR ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a Cu-Fe-P-based copper alloy thin plate having good resin adhesion and suited to be used as a heat dissipation board in chip-on-board of an LED chip or the like capable of efficiently dissipating heat.

SOLUTION: A copper alloy strip material contains 1.5 to 2.4 mass% of Fe, 0.008 to 0.08 mass% of P, 0.01 to 0.5 mass% of Zn and a remainder composed of Cu and inevitable impurities. In the copper alloy strip material: orientation density of a cube orientation measured by an EBSD method in a crystal structure of a depth range up to 10 μm from the surface of the copper alloy strip material is 10 to 20%; an average crystal grain size measured by the EBSD method is 12 to 20 μm; a maximum height Rz of a surface of a portion obtained by roughening the surface of the copper alloy strip material by a surface treatment agent is 1.0 to 2.0 μm; arithmetic mean roughness Ra of a surface of a portion which is not roughened is 0.02 to 0.05 μm; a maximum height Rz of the surface of the portion which is not roughened is 0.20 to 0.40 μm; and a ratio Rq/Rz of root mean square roughness Rq to the maximum height Rz is 0.10 to 0.25.

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