| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package, a mounting substrate to mount the same, and a semiconductor device having a high packaging yield, excellent in mounting performance and packaging reliability by effectively preventing a solder bridge between adjacent external connection terminals after a solder mounting in a semiconductor device in which a semiconductor package is mounted on a mounting substrate. <P>SOLUTION: The semiconductor package comprises: a plurality of external connection terminals provided on one surface; and at least one wall-shaped component which surrounds a part or all of a periphery of the external connection terminals. <P>COPYRIGHT: (C)2012,JPO&INPIT |
