LOW-TEMPERATURE-SINTERABLE BONDING MATERIAL, AND BONDING METHOD USING THE BONDING MATERIAL

摘要

Disclosed is a bonding material which enables the formation of a bonded article in a nitrogen atmosphere, can exhibit practically effective bonding strength without the need of carrying out any heat treatment procedure under pressurized or high-temperature conditions, and has reduced fluctuation in bonding between samples. The bonding material comprises: silver nanoparticles which have an average primary particle diameter of 1 to 200 nm and are coated with an organic substance having 8 or less carbon atoms; and a flux component which comprises a dispersion medium having a boiling point of 203°C or higher and an organic substance having at least two carboxyl groups. Particularly preferably, a combination of silver nanoparticles and submicron silver particles is used.