DIE-BONDING MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICES AND OPTICAL SEMICONDUCTOR DEVICE USING SAME

摘要

The disclosed die-bonding material for optical semiconductor devices has high thermal conductivity and can make an optical semiconductor device crack-resistant. Said die-bonding material contains: a first silicone resin that contains hydrogen atoms bound to silicon atoms; a second silicone resin that contains alkenyl groups and does not contain any hydrogen atoms bound to silicon atoms; and a hydrosilylation catalyst. The die-bonding material also contains one or both of the following substances: a magnesium carbonate anhydrous salt, represented by the chemical formula MgCO3, which contains no water of crystallization; and a coated substance in which the surface of the aforementioned magnesium carbonate anhydrous salt is coated by an organic resin, a silicone resin, or silica.