发明名称 METHOD OF MANUFACTURE OF IC CONTACTLESS COMMUNICATION DEVICES
摘要 A method of manufacture of an electrical bridge including the following steps: (a) providing a first flexible electrically insulating material, (b) laminating a pattern of a second electrically conductive material, on the first material, (c) separating a strap having a connection portion formed from the pattern of electrically conductive material.
申请公布号 US2011302770(A1) 申请公布日期 2011.12.15
申请号 US20080998916 申请日期 2008.12.17
申请人 RADENNE JEAN PIERRE;MATHIEU CHRISTOPHE;BERDALLE LAURENT 发明人 RADENNE JEAN PIERRE;MATHIEU CHRISTOPHE;BERDALLE LAURENT
分类号 H01P11/00;H01R43/00 主分类号 H01P11/00
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