| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film for semiconductor which enables the manufacture of a highly reliable semiconductor device, while improving the easiness of picking up a workpiece and preventing the occurrence of a trouble with a semiconductor element, and to provide a semiconductor device manufacturing method using the film for semiconductor. <P>SOLUTION: A film 10 for semiconductor has: a support film 4; a second adhesive layer 2; a first adhesive layer 1 and an adhesion layer 3, which are stacked in this order. The adhesion layer 3 includes, as a constituent, (meta) acrylic acid ester copolymer having a glass transition point of 0°C or below. The adhesion forces between the adhesion layer 3 and the first adhesive layer 1 at 23°C and 60°C are 30 N/m or below. A semiconductor wafer 7 is stacked on the adhesion layer 3 of the film 10 for semiconductor. When dicing the semiconductor wafer 7 into workpieces, the film for semiconductor supports the semiconductor wafer 7, and the adhesion layer 3 is exfoliated from the first adhesive layer 1 at picking up the resultant workpieces. <P>COPYRIGHT: (C)2012,JPO&INPIT |
