| 摘要 |
According to one embodiment, a method of manufacturing a camera module includes, disposing a first member on the image sensor, the first member includes a first non-conductor, a first metal film covering the first non-conductor, and a first insulation film covering the first metal film, disposing a second member on or above the first member, the second member includes a second non-conductor, a second metal film covering the second non-conductor, and a second insulation film covering the second metal film, and applying a predetermined voltage between the first member and the second member or between the image sensor and the second member, thereby breaking at least parts of the first insulation film and the second insulation film.
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