FILM ANTENNA AND MANUFACTURING METHOD THEREOF

摘要

The disclosed film antenna manufacturing method involves: a step for bonding a temporary fixing film to one side of a resin film substrate which has on the other side a first conductive layer; a step for bonding on the surface of said other side of the film substrate a masking film formed having plating treatment holes so as to cover the first conductive layer but not the power source for plating treatment; a step for applying a voltage to the first conductive film by means of the power source for plating treatment and forming by plating a second conductive layer on the first conductive layer exposed through the plating treatment holes; a step for peeling the masking film from the film substrate; a step for cutting the film substrate into the shape of an antenna circuit unit which includes the second conductive layer; a step for peeling from the temporary fixing film the resin film and the first conductive layer in at least the portion around the antenna circuit unit; a step for bonding a cover film to the aforementioned other side of the film substrate; a step for peeling the temporary fixing film from the film substrate; and a step for bonding the cover film and a base film such that at least the portion of the antenna circuit unit around the first conductive layer is sandwiched between the cover film and the base film so as to be tightly surrounded.