| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component package in which quality of soldering between a substrate pad and a lid can easily be determined by observation from the outside, and the method of manufacturing the same. <P>SOLUTION: The flange part 16a of the lid 8a is formed so that a distance p from a carrier substrate 2a till the face 18 opposite to the face 17 of the flange part 16a which faces the carrier substrate 2a becomes shorter than a distance q from the carrier substrate 2a till the crown 21a of a body part 13, the face 17 of the flange part 16a which faces the carrier substrate 2a or the portion 23 of the side wall 22 of the body part 13 which faces the carrier substrate 2a has a protrusion 26 protruding toward the carrier substrate 2a side, a further outside portion 28 than the protrusion 26 in the face 17 of the flange part 16a which faces the carrier base 2a is soldered to the substrate pad 7, and a quantity of solder 11 existing in the outside portion 28 is more in comparison with a quantity of solder 11 existing in the further inside portion 31 than the protrusion 26. <P>COPYRIGHT: (C)2012,JPO&INPIT |
