| 摘要 |
<P>PROBLEM TO BE SOLVED: To sufficiently suppress applying of impact to a semiconductor device. <P>SOLUTION: The semiconductor device tray 100 has: flexible sheet-like cushioning materials 1, 2 deformed along the semiconductor device 50; and a body 3 being a frame-like body 3 holding circumferential edges of the cushioning materials 1, 2 and holding the semiconductor device 50 via the cushioning materials 1, 2. The semiconductor device tray 100 is composed so as to be used as a plurality of the semiconductor device trays 100 in a stacked state. The semiconductor device tray 100 has the first cushioning material 1 carrying out face support of a lower face of the semiconductor device 50, and the second cushioning material 2 deformed along a top face of the semiconductor device 50 face-supported by a first cushioning material 1 of another semiconductor device tray 100 positioned one step lower than the semiconductor device tray 100. <P>COPYRIGHT: (C)2012,JPO&INPIT |
