DEVICES FOR METHODOLOGIES FOR DEBONDING AND HANDLING SEMICONDUCTOR WAFERS

摘要

Disclosed are systems, devices and methodologies for debonding wafers from carrier plates and handling of debonded wafers. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force or a shear force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed. Also disclosed are various devices and methodologies for handling and processing wafers that have been debonded from their carriers.