| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board, by which a printed wiring board including a conductive film having excellent adhesiveness to an electric insulator layer containing polyimide can be manufactured through less steps. <P>SOLUTION: An ink for forming a conductive film contains: a water-insoluble organic solvent having a boiling point of 150-350°C at an atmospheric pressure of 0.1 MPa; a metal microparticle and/or a hydrogenated metal microparticle that are dispersed in the organic solvent; and an amino compound having an amine value of 10-190 mgKOH/g in conformity with JIS K7237. The ink for forming a conductive film is applied on a surface of an electric insulator layer 12 to form a coating film, and the coating film is fired to form a conductive film 14. <P>COPYRIGHT: (C)2012,JPO&INPIT |
