发明名称 Package Substrate
摘要 In accordance with an embodiment, a substrate layout comprises a ground plane of a first power loop on a layer of a substrate, a first trace rail on the layer extending along a first periphery of the ground plane, and a first perpendicular trace coupled to the first trace rail. The ground plane is between the first trace rail and a die area, and the first perpendicular trace extends perpendicularly from the first trace rail. The first trace rail and the first perpendicular trace are components of a second power loop.
申请公布号 US2011304998(A1) 申请公布日期 2011.12.15
申请号 US20100814102 申请日期 2010.06.11
申请人 GLOBAL UNICHIP CORP.;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LIN CHIN-SUNG;LIN LI-HUA;LIN YU-YU
分类号 H05K7/00;H05K1/00;H05K1/11;H05K13/04 主分类号 H05K7/00
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