发明名称 |
NO LEAD PACKAGE WITH HEAT SPREADER |
摘要 |
A no-lead electronic package including a heat spreader and method of manufacturing the same. This method includes the steps of selecting a matrix or mapped no-lead lead frame with die receiving area and leads for interconnect; positioning an integrated circuit device within the central aperture and electrically interconnecting the integrated circuit device to the leads; positioning a heat spreader in non-contact proximity to the integrated circuit device such that the integrated circuit device is disposed between the leads and the heat spreader; and encapsulating the integrated device and at least a portion of the heat spreader and leads in a molding resin.
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申请公布号 |
US2011304032(A1) |
申请公布日期 |
2011.12.15 |
申请号 |
US201113213527 |
申请日期 |
2011.08.19 |
申请人 |
RAMOS MARY JEAN BAJACAN;ANTONIO ROMARICO SANTOS SAN;SUBAGIO ANANG |
发明人 |
RAMOS MARY JEAN BAJACAN;ANTONIO ROMARICO SANTOS SAN;SUBAGIO ANANG |
分类号 |
H01L23/495;H01L21/56 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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