发明名称 |
FULL-ENCLOSURE, CONTROLLED-FLOW MINI-ENVIRONMENT FOR THIN FILM CHAMBERS |
摘要 |
An enclosure for generating a secondary environment within a processing chamber for coating a substrate. An enclosure wall forms a secondary environment encompassing the coating source, plasma, and the substrate, and separating them from interior of the processing chamber. The enclosure wall includes a plurality of pumping channels for diverting gaseous flow away from the substrate. The channels have an intake of larger diameter from the exhaust opening and are oriented at an angle with the intake opening pointing away from the deposition source. A movable seal enables transport of the substrate in open position and processing the substrate in closed position. The seal may be formed as a labyrinth seal to avoid particle generation from a standard contact seal. |
申请公布号 |
US2011303148(A1) |
申请公布日期 |
2011.12.15 |
申请号 |
US201113157077 |
申请日期 |
2011.06.09 |
申请人 |
XIE JUN;FAIRBAIRN KEVIN P.;LIU CHARLES;LEAHEY PATRICK;RUCK ROBERT L.;BLUCK TERRY |
发明人 |
XIE JUN;FAIRBAIRN KEVIN P.;LIU CHARLES;LEAHEY PATRICK;RUCK ROBERT L.;BLUCK TERRY |
分类号 |
C23C16/50 |
主分类号 |
C23C16/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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