MULTILAYER WIRING SUBSTRATE, AND MANUFACTURING METHOD FOR MULTILAYER WIRING SUBSTRATE

摘要

The multilayer wiring substrate of the present invention is provided with: an inner layer wiring substrate having wiring on both surfaces; an electrical insulation substrate having through-holes filled with an electrically conductive paste; and wiring formed on the outermost layer. The wiring substrate and the electrical insulation substrate are alternately stacked and the wiring on the wiring substrate is arranged so as to be embedded in the electrical insulation substrate at both ends of the electrically conductive past.