ENCLOSURE OF ELECTRONIC DEVICE

摘要

An enclosure of an electronic device includes a bottom wall and a sidewall. A motherboard is mounted on the bottom wall. The motherboard includes a heat generation apparatus and a heat sink attached thereon. The heat sink is in contact with the heat generation apparatus, and is configured to transmit heat from the heat generation apparatus to the heat sink. The sidewall defines a number of vents, which are in alignment with the heat sink. A fan is mounted between the sidewall and the heat sink with an air inlet side of the fan directed towards the heat sink and an air outlet side of the fan directed towards the plurality of vents.