RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

摘要

Disclosed is a resin-sealed semiconductor device which has: a power element (1) and a control element (4); a first leadframe (3), which includes a first die pad section (3A) that holds the power element (1); a second leadframe (5), which includes a second die pad section (5A) that holds the control element (4); and an outer housing (6), which is composed of a resin material that seals the power element, the first die pad section, the second element and the second die pad section. The lower surface of the second die pad section is disposed higher than the upper surface of the power element, and at least a part of the first die pad section and at least a part of the second die pad section overlap each other in planar view. One of a plurality of first leads and one of a plurality of second leads are electrically connected to each other inside of the outer housing by means of a connecting section (23) directly bonded inside of the outer housing.