<p>A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.</p>
申请公布号
EP1070347(B1)
申请公布日期
2011.12.14
申请号
EP19990907033
申请日期
1999.02.15
申请人
MINNESOTA MINING AND MANUFACTURING COMPANY
发明人
BENNETT, RICHARD, E.;WINSLOW, LOUIS, E.;BENNETT, GREGGORY, S.;ALAHAPPERUMA, KARUNASENA, A.