发明名称 |
Method for bonding labels. |
摘要 |
<p>Adhesive bonding of a label with a UV-curable adhesive comprises thermally applying the adhesive to a substrate, bonding with a second substrate, and irradiating with a UV source. The adhesive exhibits a viscosity of less than 5000 mPas at a temperature of 20-130[deg] C. A UV-emitting LED-radiation source is used as a UV source and the temperature during the irradiation process in the substrate region is less than 80[deg] C.</p> |
申请公布号 |
EP2394918(A1) |
申请公布日期 |
2011.12.14 |
申请号 |
EP20100165276 |
申请日期 |
2010.06.08 |
申请人 |
HENKEL AG & CO. KGAA |
发明人 |
HERLFTERKAMP, BERNHARD;PUERKNER, ECKHARD;BIALAS, NORBERT |
分类号 |
B65C9/25;C09J7/02;G09F3/10 |
主分类号 |
B65C9/25 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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