RESIN COMPOSITION FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT AND LIGHT EMITTING DEVICE

摘要

PURPOSE: A resin composition for encapsulating optical semiconductor element is provided to obtain the refractive index of greater than 1.45, after hardening, excellent sulfidation resistance, and long-term reliability. CONSTITUTION: A resin composition(4) for the encapsulating optical semiconductor element comprises: organopolysiloxane having aliphatic unsaturated bond containing monovalent hydrocarbon group; organohydrogenpolysiloxane containing two or more hydrogen atoms combined with silicon atom per one molecule; a platinum-based catalyst; and a glass filler(7) with anisotropic shape of which aspect ratio is 1.1-50. The refractive index of the hardened material is 1.45 or greater. The glass filler of anisotropic shape is scale-like glass or chopped strands.