| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for processing a surface where the surface of a glass substrate is processed without causing a difference between a removing amount (calculated value) estimated for flattening and an actual removing amount in actual processing even if the scanning speed is increased when the surface of the glass substrate is processed by supplying an etchant to a gap between a processing head and the glass substrate and discharging the etchant by sucking while scanning the processing head to the opposed glass substrate. <P>SOLUTION: An etchant channel having a fixed area is formed in the gap between the processing head 2 and the glass substrate 3 by charging the etchant on the surface of the glass substrate 3 and sucking the same with the processing head 2. The etchant is confined in the etchant channel by being pressurized with the pressurized gas stream of a dry gas flowing from the whole circumference toward the center of the etchant channel so that the etchant flowing through the etchant channel surrounds the outer periphery of the etchant channel from the outside of the etchant channel when the surface of the glass substrate 3 is processed by relatively scanning the processing head 2 and the glass substrate 3. <P>COPYRIGHT: (C)2012,JPO&INPIT |
