发明名称 |
Printed wiring board, electronic device, and printed wiring board manufacturing method |
摘要 |
A printed wiring board (10) includes an insulating resinous substrate (11) having an aperture unit (11a), a first terminal unit (12a) and a second terminal unit (12b) consisting of a conductor and formed on top of the resinous substrate (11), and a fuse unit (12c) that electrically couples the first terminal unit (12a) and the second terminal unit (12b) to each other. At least a part of the fuse unit (12c) is disposed over the aperture unit (11a), and in addition, is covered by a porous inorganic covering material (13) having insulating properties. |
申请公布号 |
EP2395821(A1) |
申请公布日期 |
2011.12.14 |
申请号 |
EP20110169480 |
申请日期 |
2011.06.10 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
HIRAMATSU, YASUJI;TERADA, YUKI;MURAKI, TETSUYA |
分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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