发明名称 Printed wiring board, electronic device, and printed wiring board manufacturing method
摘要 A printed wiring board (10) includes an insulating resinous substrate (11) having an aperture unit (11a), a first terminal unit (12a) and a second terminal unit (12b) consisting of a conductor and formed on top of the resinous substrate (11), and a fuse unit (12c) that electrically couples the first terminal unit (12a) and the second terminal unit (12b) to each other. At least a part of the fuse unit (12c) is disposed over the aperture unit (11a), and in addition, is covered by a porous inorganic covering material (13) having insulating properties.
申请公布号 EP2395821(A1) 申请公布日期 2011.12.14
申请号 EP20110169480 申请日期 2011.06.10
申请人 IBIDEN CO., LTD. 发明人 HIRAMATSU, YASUJI;TERADA, YUKI;MURAKI, TETSUYA
分类号 H05K1/02 主分类号 H05K1/02
代理机构 代理人
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