| 摘要 |
<p>#CMT# #/CMT# The ejector (1) has a drive unit for displacing plates (8), where the drive unit comprises a drive mechanism (11) with a motor (14) and a pin (13). The pin is moved back and forth between two positions along a predetermined path by the motor. Each plate has a path-like opening, and the pin is guided through the path-like opening of each plate. The path-like opening is different from plate to plate such that the plates are displaced in a predetermined sequence in desired direction when the pin is moved along the path. #CMT#USE : #/CMT# Die ejector for mounting semiconductor chips from a foil in a frame. #CMT#ADVANTAGE : #/CMT# The vacuum prevailing in a gap exerts a suction force on the bottom side of the foil, and draws the foil towards the cover plate of the ejector, thus ensuring rapid, reliable and damage-free detachment of the semiconductor chips from the foil. The ejector can be adjusted according to the semiconductor chips of different sizes in an efficient manner. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a side and cross-sectional views of a die ejector. 1 : Die ejector 2 : Enclosed chamber 3 : Exchangeable cover plate 4 : Foil 5, 5' : Semiconductor chips 8 : Plates 9 : Surface 11, 12 : Drive mechanisms 13 : Pin 14 : Motor.</p> |
