Device for cooling integrated circuits

摘要

The present invention is related to a device for cooling the surface of a semiconductor device such as an integrated circuit or the like, said cooling device comprising a plurality of channels (3') which are non-parallel to the surface to be cooled, each channel comprising a plurality of separate electrodes (5) or equivalent conducting areas arranged along the length of each channel, the device further comprising or being connectable to means for applying a voltage to said electrodes or conducting areas in each channel according to a sequence, said sequence being such that a droplet (6) of cooling liquid in a channel may be moved from one electrode to the next, thereby transporting the droplet from the top of the channel to the bottom, from where the droplet impinges on the surface to be cooled.