| 摘要 |
PURPOSE: A multi-chip package is provided to transfer signals between semiconductor chips by a metal bar formed on a side of a semiconductor chip, thereby simplifying the structure of the circuit pattern of a substrate. CONSTITUTION: A connection pad(110) is formed on the top of a substrate(100). A borland is formed on the bottom of the substrate. The other side of a first semiconductor chip(200) is attached onto the top of the substrate by a first adhesive member. A second semiconductor chip(300) is separated from the first semiconductor chip on the top of the substrate. A metal bar(400) is attached to the first bonding pad of the first semiconductor chip and the third bonding pad of the second semiconductor chip. |
