发明名称 |
PIN ELECTRONICS LIQUID COOLED MULTI-MODULE FOR HIGH PERFORMANCE, LOW COST AUTOMATED TEST EQUIPMENT |
摘要 |
In one embodiment, a channel board-to-DIB junction multi-module is provided which includes performance critical channel electronics modules within an enclosure encasing the plurality of performance critical channel electronics modules. A coolant distribution apparatus is provided within the enclosure to provide cooling within the enclosure. A channel board connection apparatus is located at a channel board end of the channel board-to-DIB junction multi-module and a cable-less connection apparatus is located at a DIB end of the channel board-to-DIB junction multi-module. |
申请公布号 |
KR20110134469(A) |
申请公布日期 |
2011.12.14 |
申请号 |
KR20117023728 |
申请日期 |
2010.03.10 |
申请人 |
TERADYNE, INC. |
发明人 |
BREINLINGER KEITH;OSTERTAG EDWARD;SARTSCHEV RONALD A.;TENEKETGES NICHOLAS J. |
分类号 |
H01L21/66;G01R1/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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