| 摘要 |
PURPOSE: An adhesive composition and an adhesive sheet are provided to prevent a chip from being crushed and split by reducing power for a pick-up process. CONSTITUTION: An adhesive composition includes an acrylic polymer, an epoxy resin, a thermosetting agent, and a silicone compound. The silicone compound is organopolysiloxane having an aromatic ring-containing group as a side chain. The silicone compound has 50~100,000 mm^2/s dynamic viscosity at 25°C. The aromatic ring-containing group excludes a reactive organic functional group. |
