| 发明名称 |
Substrate having sintered underplate |
| 摘要 |
A substrate includes a metal portion (22) and an underplate (24) that is laser sintered to the metal portion (22). The metal portion (22) has a melting point that is lower than a sintering temperature of the underplate (24) |
| 申请公布号 |
EP2395547(A2) |
申请公布日期 |
2011.12.14 |
| 申请号 |
EP20110163824 |
申请日期 |
2011.04.27 |
| 申请人 |
PRATT & WHITNEY ROCKETDYNE INC. |
发明人 |
HERTEL, THOMAS A. |
| 分类号 |
H01L23/14 |
主分类号 |
H01L23/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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