PROCESS FOR PRODUCING MULTILAYER CERAMIC SUBSTRATE

摘要

To provide a method for manufacturing a multilayer ceramic board that can prevent a wiring conductor formed on the face of a multilayer ceramic board fabricated with non-contraction process from being damaged. On at least one principal face of a layered body, made up of a plurality of board ceramic green sheets 11 including ceramic material powder, contraction prevention green sheets 21 and 25 including inorganic material powder which is not sintered at the baking temperature of the board ceramic green sheet 11 are disposed such that along at least a part of the outer circumference of the principal face the part and the nearby portion thereof are exposed to form a compound layered body, the compound layered body is baked under a condition in which the ceramic material powder is sintered, and the inorganic material powder is not sintered, following which the contraction prevention green sheets 21 and 25 are removed. With a multilayer ceramic board 10t, protruding portions 12x and 12y are formed along at least a part of the outer circumference of a principal face 11t.