<p>PURPOSE: A method for forming a photoresist pattern is provided to perform light exposing and developing processes twice under the same conditions, thereby readjusting processing conditions. CONSTITUTION: A mask film(104) is coated on a substrate(100) on which a target film(102) to be etched is formed. A reflection preventing film(110) is coated on the mask film. The reflection preventing film is made of organic and inorganic materials to prevent diffused reflection during a light exposure process. The reflection preventing film includes an inorganic reflection preventing film(106) and an organic reflection preventing film(108). A first photoresist film is coated on the reflection preventing film to form a reserved first photoresist pattern.</p>
申请公布号
KR20110133828(A)
申请公布日期
2011.12.14
申请号
KR20100053453
申请日期
2010.06.07
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KIM, KYOUNG MI;PARK, JEONG JU;PARK, MI RA;LEE, BO HEE;KIM, JAE HO;KIM, YOUNG HO