发明名称 METHOD OF FORMING A PHOTORESIST PATTERN
摘要 <p>PURPOSE: A method for forming a photoresist pattern is provided to perform light exposing and developing processes twice under the same conditions, thereby readjusting processing conditions. CONSTITUTION: A mask film(104) is coated on a substrate(100) on which a target film(102) to be etched is formed. A reflection preventing film(110) is coated on the mask film. The reflection preventing film is made of organic and inorganic materials to prevent diffused reflection during a light exposure process. The reflection preventing film includes an inorganic reflection preventing film(106) and an organic reflection preventing film(108). A first photoresist film is coated on the reflection preventing film to form a reserved first photoresist pattern.</p>
申请公布号 KR20110133828(A) 申请公布日期 2011.12.14
申请号 KR20100053453 申请日期 2010.06.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, KYOUNG MI;PARK, JEONG JU;PARK, MI RA;LEE, BO HEE;KIM, JAE HO;KIM, YOUNG HO
分类号 H01L21/027 主分类号 H01L21/027
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