| 摘要 |
<p>PURPOSE: A light emitting diode package is provided to have various color temperatures by mounting a plurality of sub - packages in a mold cup. CONSTITUTION: In a light emitting diode package, a mold cup(110) accepts a sub - package(120) inside. The sub - package comprises a light emitting diode chip and a fluorescent substance resin layer. The sub - package receives an external signal through a lead frame and a lead terminal(130). The lead terminal is extended to outside from the both ends of the mold cup A sealing resin layer(140) is arranged in order to surround the sub - package within the mold cup.</p> |
