| 摘要 |
PURPOSE: A semiconductor module and a semiconductor device are provided to miniaturize a semiconductor module and realize efficient heat emission and certain ground. CONSTITUTION: A circuit board(2) is arranged on the upper side of a semiconductor device(1). The semiconductor device comprises lead terminals(9A,9B,10,11). The circuit board comprises major surfaces which are opposite each other. The circuit board is fixed to a heat emitting machine by screws(4,4A,4B). A through hole is formed on a base frame(5). |
