| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent void generation in adhesive as much as possible, and to suppress deterioration of heat dissipation in an electronic apparatus, wherein a resin member is arranged over the whole surface of a ceramic substrate and the resin member is adhered to a heatsink with adhesive. <P>SOLUTION: After forming a resin member 40 over the whole surface of a ceramic substrate 20, the resin member 40 is heat-treated, and then the resin member 40 is adhered with adhesive 30. Heat treatment for the resin member 40 is performed so that the percentage of moisture content may be less than 3%. The percentage of moisture content is defined as a ratio of moisture content that the resin member 40 absorbs to the constant weight of the resin member 40. The constant weight is the weight of the resin member 40 when it is dried up to 100°C to 110°C. <P>COPYRIGHT: (C)2009,JPO&INPIT |
